1、将印刷在凸点金属表面上的锡膏回流成球状,完成锡球与基板相结合焊接;
2、在芯片贴片到集成电路板上后,将芯片和电路板连接在一起,实现芯片封装和集成电路生产制造。
1、 专利热风系统,高效热补偿能力,精准控温精度;
2、 全程氮气保护,各温区氮气独立控制, 防止元件在焊接过程中氧化;
3、 炉内低氧含量控制,实时显示,全程氧浓度可控制在50-200PPM内,确保优良焊接品质;
4、 模块化设计,高效冷却系统,冷却斜率可达到0.5-6℃/S,满足各工艺冷却斜率要求;
5、细目网带平稳传送,可以过微小元器件传送,防止掉件,确保产品质量稳定;
6、高效洁净处理,满足半导体无尘车间要求。
型号/Model No | SEMI-08N | SEMI-10N | SEMI-13N |
加热部分/Heating system | |||
温区配置/Heating zone structure |
8温区,16加热模块 8 heating zones, 16 heating modules |
10温区,20加热模块 10 heating zones, 20 heating modules |
13温区,26加热模块 13 heating zones, 26 heating modules |
加热区长度/Heating zone length | 2950mm | 3670mm | 4750mm |
升温时间/Heating up time | 20min | 25min | 25min |
排风口直径,排量 Outlet Exhaust Diameter,valume |
2-0145,排风量要求10m³/min x22-0145,Exhaust demand 10m³/min x2 | ||
冷却部分/Cooling system | |||
冷却方式/Cooling type | 三冷却区:强制水冷/Three cooling zones:forced water cooling | ||
冷却区长度/Cooling zone length | 1250mm | ||
冷水机功率/Chiller power | 5P冷水机(选配:接客户车间冷却水)/5P Water chiller (Optional: connected to customer workshop cooling water) | ||
运输部分/Conveyor system | |||
传送方式/Conveyor Type | 细目网带(选配:乙字型网带,力骨式网带)/Fine mesh mesh belt (Optional: B-shaped mesh belt, force bone mesh belt) | ||
运输方向/Conveyer Direction | 左→右,右→左/L→R,R→L | ||
运输带高度/Converyer Height | 900±20mm | ||
网带宽度/Mesh belt width | 24"(可根据需求定制其它宽度尺寸)/24"(Other width sizes can be customized.) | ||
基板元件高度/Cmponent Height | 20mm | ||
传送速度/Conveyor Speed | 300mm-2000mm/min | ||
控制部分/Control system | |||
电源/Power | AC3Ø 5W 380V 50/60HZ | ||
总功率/Total Power | 70KW | 89KW | 118KW |
启动功率/Startup Power | 35KW | 38KW | 42KW |
正常运行功率/Normal consumption | 10KW | 12KW | 14KW |
工作温度范围/Temp Control Range | 室温-320℃/Room temperature to 320℃ | ||
控制方式/Control type | PC+PLC控制系统/PC+PLC Control system | ||
温度控制精度/ Temp Control accuracy | ±1℃ | ||
PCB板温分布偏差/PCB Temp Deviation | ±1.5℃ | ||
设置参数存储/Data Storage | 可存多种设置参数/Process Data and status stotage | ||
停电保护/Power Outage Protection | UPS延时关机/Equipped with UPS | ||
操作界面/Operation Interface | Windows中文简体,英文在线自由切换/Windows Chinese simplified, English online free switching | ||
氮气区域/N2 area | 全程充氮气/Full nitrogen filling | ||
Secs/Gem通讯协议 Secs/Gemcommunication protocol |
标配/Standard | ||
MES通讯协议/MES communication protocol | 标配/Standard | ||
电脑主机/Computer | 商用大电脑/Commercial computer | ||
机体参数/General | |||
外形尺寸/Dimension(LxWxH) | 5680x1710x1650mm | 6400*1710*1650mm | 7500*1710*1650mm |
重量/Weight | 2400-2600kg | 3200-3400kg | 3600-3800kg |
助焊剂回收系统/Flux recovery system | 标配/Standard | ||
外观颜色/Color | 光亮皱纹白/Bright wrinkled white |